• 2018.08

    ISO 14001:2008 change to ISO 14001:2015

  • 2018.05

    ISO 9001:2008 change to ISO 9001:2015

  • 2018.05

    Ying Yi obtain IATF 16949:2016 certificate

  • 2018.05

    DIP increased one XIN CHAMPION Wave Soldering Machine(Max 500mm)

  • 2017.12

    SMT increased two Panasonic SMT line(Total 8 SMT Line、 Capacity is 10.5 million chips per day)

  • 2017.01

    Ying Yi obtain ISO 28000:2007 certificate

  • 2016.10

    SMT increased one Panasonic SMT line(NPM W2 *3)

  • 2015.07

    Ying Yi pass SMETA audit from SGS

  • 2014.10

    SMT increased one Panasonic SMT line(NPM W *3)

  • 2012.02

    SMT POP(Package on Package)process phased in

  • 2009.04

    ISO 9001:2000 change to ISO 9001:2008

  • 2007.02

    IPC & PND & Security product phase in total production process

  • 2006.05

    SMT increased one YAMAHA line(Chip mount capability upgrade to 01005)

  • 2005.03

    Add a X-Ray(3D TYPE)equipment.GPS module PCB'A OEM shippin

  • 2004.11

    Capital increased to US$7.5millions,add 2 SMT line/month

  • 2004.07

    Ying Yi obtain ISO 14001 certificate

  • 2004.05

    SMT & DIP(Lead Free Process)formally mass production

  • 2004.04

    SMT & DIP Lead Free Process Approved By Sony